2017-05-30 15:41:55 浏览:736
兼中国金属学会材料科学学会理事、中国仪器仪表材料学会理事、材料疲劳与断裂国家重点实验室、金属材料强度国家重点实验室及全军装备维护开放研究实验室学术委员会委员。 国际喷丸学术委员会委员。
主要项目
1. 国家973基础研究计划项目, 材料介观性能基本参量的实验表征,编号:2004CB619302,2004-2008
2.国家自然科学基金委重大国际合作项目(英国),超硬薄膜的力学性能表征,编号:50420130033,2004-2006年
近期代表作:
1. Dayan Ma, Shengli Ma, Hanshan Dong, Kewei Xu, Tom Bell, Microstructure and tribological behavior of super hard Ti-Si-C-N nanocomposite coatings deposited by pulsed d.c. plasma CVD, Thin Solid Films, 2006, 496:438-444
2. MA Sheng-li, XU Ke-wei, JIE Wan-qi, Plasma nitrided and TiCN coated AISI H13 steel by pulsed dc PECVD and its application for hot-working dies,Surf. Coat.Technol., 2005, 191:201-205
3. Shengli Ma, J. Prochazka, P. Karvankova, Qingsong Ma, Xinping Niu, Xin Wang, Dayan Ma, Kewei Xu, S.Veprek, Comparative study of the Tribological Behaviour of Superhard Nanocomposite Coatings nc-TiN/a-Si3N4 with TiN, Surf. Coat. Technol., 2005, 194: 143-148
4.Qingsong Ma, Shengli Ma, Kewei Xu, Tribological behaviors of Ti-Si-N coatings prepared by physical vapor deposition, J.Vac.Sci.Technol.A, 2005, 23 (1): 12-17
5.Shengli Ma, Kewei Xu, Wanqi Jie, Wear behavior of modified surface of Ti-6Al-4V alloy treated by pulsed dc plasma-duplex process, Surf. Coat. Technol., 2004, 185:205-209
6. MA Sheng-li, XU Ke-wei, JIE Wan-qi, Structural characterization of nanocomposite Ti-Si-N coatings prepared by pulsed d.c. plasma enhanced CVD, J.Vac.Sci.Technol.B, 2004, 22(4):1694-1698
7. Dayan Ma, Shengli Ma, Kewei Xu, Influence of Si content on nano-structured Ti-Si-N films coated by pulsed-d.c.plasma enhanced CVD, Surf. Coat. Technol., 2004, 184(2-3):182-187
8. Shengli Ma, Kewei Xu, Jiawen He, Parametric effects of residual stress in pulse dc plasma enhanced CVD TiN coatings, Surf. Coat. Technol., 2001, 142-144:1023-1027
9. Shengli Ma, Yanhuai Li, Kewei Xu, The composite of nitrided H13 steel and TiN coatings by plasma duplex treatment, Surf. Coat. Technol., 2001,137: 116-121
10. Shengli Ma, Kewei Xu, Vincent Ji, Diagnostics of TiN Coating Process in Pulsed D.C Plasma Enhanced Chemical Vapor Deposition, Journal De Physique IV, 2001, 11:1109-1116